The Snapdragon 765 (G) is Qualcomm's first system-on-a-chip that integrates the 5G modem directly into the chip with support for all current standards. This point is even ahead of the Snapdragon 865. In terms of performance, the chip sorts itself above the Snapdragon 730 (G). The market launch will take place in the first quarter of 2020.
With its 11.83 × 11.83 mm chip package, the Snapdragon 765 is more compact than the Snapdragon 865 – even though the 5G multi-mode modem on the Snapdragon 765 was first integrated into the chip at Qualcomm. On Qualcomm's first 5G platform, the Snapdragon 855, the Snapdragon X50 had to be externally connected as a modem, while the new Snapdragon 865 is the Snapdragon X55.
Snapdragon X52 delivers integrated 5G
In the Snapdragon 765, the new modem development is called Snapdragon X52. It is a slightly weaker offshoot of the Snapdragon X55, but it supports the same standards to be used globally for 5G, but at the top, it achieves lower transfer rates. MmWave bundles up to 400MHz instead of 800MHz for 3.7Gbps, and in the sub-6GHz range it is a maximum of 100MHz instead of the Snapdragon X55's 200MHz. More important for global success are capabilities such as covering all 5G bands in North America, Europe, South Korea, Japan, China, Southeast Asia and Oceania, operating in the current non-standalone (NSA) and later stand-alone (SA) or splitting frequencies at 5G and LTE via the TDD method so that mobile operators can bid on the same frequency depending on the capability of the terminal 5G and LTE.
All older standards are also designed as multimode modems: LTE, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM / EDGE.
Snapdragon 765 switches to 1 + 1 + 6 design with Prime Core
The integrated 5G modem makes the Snapdragon 765 unique in the Qualcomm portfolio. In addition, many similarities to the Snapdragon 730 can quickly be discovered, but also features from the Snapdragon 855 and 865 were inherited. These include the Prime Core as part of the new 1 + 1 + 6 core design, replacing the previous 2 + 6 design. The Prime Core, a Cortex-A76-based Cryo 475 Gold, clocks Qualcomm with a maximum of 2.3 GHz, while the second Cryo 475 Gold is limited to a maximum of 2.2 GHz. The six Kryo 475 Silver are again based on the Cortex-A55 and also provide 1.80 GHz as in the Snapdragon 730. The memory controller remains at LPDDR4X, but now can deal with 2133 instead of 1.866 MHz fast memory.
Qualcomm also has a G-Class
If you need more power, you can choose a smartphone with the Snapdragon 765G, the gaming version of the Snapdragon 765. Here, Qualcomm performs higher-quality binning and allows the Prime Core up to 2.4 GHz. Even with the Adreno 620 GPU, the unknown clock can turn out higher and provide for 20 percent more power than the normal Snapdragon 765. Its base version of the Adreno 620 also works 20 percent faster than the Adreno 618 of the Snapdragon 730.
The CPU, GPU and the new Hexagon 696-DSP with its own Tensor accelerators, in combination with the Snapdragon 865, form the fifth-generation KI engine and provide 5.5 TOPS of computing power. Qualcomm comes close to the 7 TOPS of the Snapdragon 855, but remains far from the 15 TOPS of the Snapdragon 865. Here are the then significantly stronger CPU and GPU noticeable.
HDR10 + enters the ISP
The Snapdragon 765 is also catching up with the ISP as the HDR10 + moves in, although Dolby Vision is reserved for the Snapdragon 865. The cameras also provide the maximum of 36 instead of 64 megapixels. These are well-known key data that already applied to the Snapdragon 730. The 720p slow motion is doubling from 240 FPS to 480 FPS with a doubling of the maximum frames per second. In normal video mode, with 4K30, including HDR and 10-bit color depth in the Rec. 2020 color space, everything stays within the known scope.
– Nicolas La Rocco (@roccetry) December 3, 2019
Qualcomm expects Snapdragon 765 (G) smartphones to hit the market in the first quarter of 2020. Nokia plans to have a dedicated smartphone for Q1 2020, as Chief Product Office Juho Sarvikas announced at the Snapdragon Tech Summit. The smartphone should be an affordable 5G entry. The MWC at the end of February should be followed by further details.
ComputerBase has received information about this article from Qualcomm in advance and as part of a manufacturer's event on Maui under NDA. The costs for arrival, departure and hotel were borne by Qualcomm. There was no influence of the manufacturer or a reporting obligation.